FDZ7064N Description
bining Fairchild’s 30V PowerTrench process with state of the art BGA packaging, the FDZ7064N minimizes both PCB space and RDS(ON). This BGA MOSFET embodies a breakthrough in packaging technology which enables the device to bine excellent thermal transfer characteristics, high current handling capability, ultra-low profile packaging, low gate charge, and low RDS(ON).
FDZ7064N Key Features
- 13.5 A, 30 V. RDS(ON) = 8.0 mΩ @ VGS = 4.5 V RDS(ON) = 7.0 mΩ @ VGS = 10 V
- Occupies only 14 mm2 of PCB area. Only 42% of the area of SO-8
- Ultra-thin package: less than 0.80 mm height when mounted to PCB
- 3.5 x 4 mm2 Footprint
- High power and current handling capability