FDZ661PZ Description
Less than 16% of the area of 2 x 2 BGA Ultra-thin package: less than 0.4 mm height when mounted to PCB HBM ESD protection level > 2 kV (Note3) RoHS pliant Designed on Fairchild's advanced 1.5 V PowerTrench® process with state of the art "fine pitch" Thin WLCSP packaging process, the FDZ661PZ minimizes both PCB space and rDS(on). This advanced WLCSP MOSFET embodies a breakthrough in packaging technology which...
FDZ661PZ Key Features
- Max rDS(on) = 140 mΩ at VGS = -4.5 V, ID = -2 A
- Max rDS(on) = 182 mΩ at VGS = -2.5 V, ID = -1.5 A
- Max rDS(on) = 231 mΩ at VGS = -1.8 V, ID = -1 A
- Max rDS(on) = 315 mΩ at VGS = -1.5 V, ID = -1 A
- Occupies only 0.64 mm2 of PCB area. Less than 16% of the
- Ultra-thin package: less than 0.4 mm height when mounted to PCB
- HBM ESD protection level > 2 kV (Note3)
- RoHS pliant