Datasheet4U Logo Datasheet4U.com

GS88136B - (GS88118B - GS88136B) Sync Burst SRAMs

This page provides the datasheet information for the GS88136B, a member of the GS88118B (GS88118B - GS88136B) Sync Burst SRAMs family.

Datasheet Summary

Description

Applications The GS88118B(T/D)/GS88132B(T/D)/GS88136B(T/D) is a 9,437,184-bit high performance synchronous SRAM with a 2bit burst address counter.

Features

  • IEEE 1149.1 JTAG-compatible Boundary Scan.
  • 2.5 V or 3.3 V +10%/.
  • 10% core power supply.
  • 2.5 V or 3.3 V I/O supply.
  • LBO pin for Linear or Interleaved Burst mode.
  • Internal input resistors on mode pins allow floating mode pins.
  • Byte Write (BW) and/or Global Write (GW) operation.
  • Internal self-timed write cycle.
  • Automatic power-down for portable.

📥 Download Datasheet

Datasheet preview – GS88136B

Datasheet Details

Part number GS88136B
Manufacturer GSI
File Size 1.04 MB
Description (GS88118B - GS88136B) Sync Burst SRAMs
Datasheet download datasheet GS88136B Datasheet
Additional preview pages of the GS88136B datasheet.

📁 Similar Datasheet

Other Datasheets by GSI
  • GS88136A - (GS88118A - GS88136A) Synchronous Burst SRAMs
  • GS88136T - (GS88118 / GS88136T) Sync Burst SRAMs
  • GS88132A - (GS88118A - GS88136A) Synchronous Burst SRAMs
  • GS88132B - (GS88118B - GS88136B) Sync Burst SRAMs
  • GS88118 - (GS88118 / GS88136T) Sync Burst SRAMs
  • GS88118A - (GS88118A - GS88136A) Synchronous Burst SRAMs
  • GS88118B - (GS88118B - GS88136B) Sync Burst SRAMs
  • GS881E36AD - Synchronous Burst SRAMs

Full PDF Text Transcription

Click to expand full text
www.DataSheet4U.com GS88118B(T/D)/GS88132B(T/D)/GS88136B(T/D) 100-pin TQFP & 165-bump BGA Commercial Temp Industrial Temp Features • IEEE 1149.1 JTAG-compatible Boundary Scan • 2.5 V or 3.3 V +10%/–10% core power supply • 2.5 V or 3.3 V I/O supply • LBO pin for Linear or Interleaved Burst mode • Internal input resistors on mode pins allow floating mode pins • Byte Write (BW) and/or Global Write (GW) operation • Internal self-timed write cycle • Automatic power-down for portable applications • JEDEC-standard 100-lead TQFP and 165-bump BGA packages • RoHS-compliant 100-lead TQFP and 165-bump BGA packages available 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.
Published: |