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GD30MPS12J - Silicon Carbide Schottky Diode

Key Features

  • Gen4 Thin Chip Technology for Low VF.
  • Superior Figure of Merit QC.
  • VF.
  • 100% Avalanche (UIL) Tested.
  • Enhanced Surge Current Withstand Capability.
  • Temperature Independent Fast Switching.
  • Low Thermal Resistance.
  • Positive Temperature Coefficient of VF.
  • High dV/dt Ruggedness Package TO-263-7 TM VRRM = IF (TC = 150°C) = QC = 1200 V 30 A 97 nC Case RoHS K A REACH Advantages.
  • Improved System Efficiency.

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Datasheet Details

Part number GD30MPS12J
Manufacturer GeneSiC
File Size 613.67 KB
Description Silicon Carbide Schottky Diode
Datasheet download datasheet GD30MPS12J Datasheet

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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GD30MPS12J 1200V 30A SiC Schottky MPS™ Diode Silicon Carbide Schottky Diode Features • Gen4 Thin Chip Technology for Low VF • Superior Figure of Merit QC*VF • 100% Avalanche (UIL) Tested • Enhanced Surge Current Withstand Capability • Temperature Independent Fast Switching • Low Thermal Resistance • Positive Temperature Coefficient of VF • High dV/dt Ruggedness Package TO-263-7 TM VRRM = IF (TC = 150°C) = QC = 1200 V 30 A 97 nC Case RoHS K A REACH Advantages • Improved System Efficiency • High System Reliability • Optimal Price Performance • Reduced Cooling Requirements • Increased System Power Density • Zero Reverse Recovery Current • Easy to Parallel without Thermal Runaway • Enables Extremely Fast Switching Applications • Power Factor Correction (PFC) • Electric Vehicles