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HB56D136 Datasheet

Manufacturer: Hitachi Semiconductor (now Renesas)
HB56D136 datasheet preview

HB56D136 Details

Part number HB56D136
Datasheet HB56D136-HitachiSemiconductor.pdf
File Size 83.71 KB
Manufacturer Hitachi Semiconductor (now Renesas)
Description High Density Dynamic RAM Module
HB56D136 page 2 HB56D136 page 3

HB56D136 Overview

The HB56D136 is a 1-M × 36-bit dynamic RAM module, mounted 8 pieces of 4 Mbit DRAM (HM514400CS/CLS) sealed in SOJ package and 2 pieces of 2 Mbit DRAM (HM512200BS/BLS) sealed in SOJ package. An outline of the HB56D136 is 72-pin single in-line package. Therefore, the HB56D136 makes high density mounting possible without surface mount technology.

HB56D136 Key Features

  • 72-pin
  • Lead pitch: 1.27 mm
  • Single 5 V (±5%) supply
  • High speed
  • Access time: 60 ns/70 ns/80 ns (max)
  • Low power dissipation
  • Active mode: 5.46 W/4.94 W/4.41 W (max)
  • Standby mode: 105 mW (max)
  • Fast page mode capability
  • 1,024 refresh cycle: 16 ms

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