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HB56D136BW Datasheet

Manufacturer: Hitachi Semiconductor (now Renesas)

This datasheet includes multiple variants, all published together in a single manufacturer document.

HB56D136BW datasheet preview

Datasheet Details

Part number HB56D136BW
Datasheet HB56D136BW HB56D136 Datasheet (PDF)
File Size 83.71 KB
Manufacturer Hitachi Semiconductor (now Renesas)
Description High Density Dynamic RAM Module
HB56D136BW page 2 HB56D136BW page 3

HB56D136BW Overview

The HB56D136 is a 1-M × 36-bit dynamic RAM module, mounted 8 pieces of 4 Mbit DRAM (HM514400CS/CLS) sealed in SOJ package and 2 pieces of 2 Mbit DRAM (HM512200BS/BLS) sealed in SOJ package. An outline of the HB56D136 is 72-pin single in-line package. Therefore, the HB56D136 makes high density mounting possible without surface mount technology.

HB56D136BW Key Features

  • 72-pin
  • Lead pitch: 1.27 mm
  • Single 5 V (±5%) supply
  • High speed
  • Access time: 60 ns/70 ns/80 ns (max)
  • Low power dissipation
  • Active mode: 5.46 W/4.94 W/4.41 W (max)
  • Standby mode: 105 mW (max)
  • Fast page mode capability
  • 1,024 refresh cycle: 16 ms
Hitachi Semiconductor (now Renesas) logo - Manufacturer

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