HB56D473EJ-7 Overview
The HB56D473EJ belongs to 8 Byte DIMM (Dual In-line Memory Module) family, and has been developed as an optimized main memory solution for 4 and 8 Byte processor applications. An outline of the HB56D473EJ is 168-pin socket type package (dual lead out). Therefore, the HB56D473EJ makes high density mounting possible without surface mount technology.
HB56D473EJ-7 Key Features
- 168-pin socket type package (Dual lead out) Outline: 133.35 mm (Length) × 25.40 mm (Height) × 9.00 mm (Thickness) Le
- Single 5 V (±5%) supply
- High speed
- Low power dissipation Active mode: 12.5/11.3 W (max) Standby mode (TTL): 588 mW (max) (CMOS): 462 mW (max)
- Buffered input except RAS and DQ
- 4 byte interleave enabled, dual address input (A0/B0)
- JEDEC standard outline buffered 8-byte DIMM
- Fast page mode capability
- 2,048 refresh cycles: 32 ms
- 2 variations of refresh RAS-only refresh CAS-before-RAS refresh