• Part: HB56D136
  • Description: High Density Dynamic RAM Module
  • Manufacturer: Hitachi Semiconductor
  • Size: 83.71 KB
Download HB56D136 Datasheet PDF
Hitachi Semiconductor
HB56D136
HB56D136 is High Density Dynamic RAM Module manufactured by Hitachi Semiconductor.
Description The HB56D136 is a 1-M × 36-bit dynamic RAM module, mounted 8 pieces of 4 Mbit DRAM (HM514400CS/CLS) sealed in SOJ package and 2 pieces of 2 Mbit DRAM (HM512200BS/BLS) sealed in SOJ package. An outline of the HB56D136 is 72-pin single in-line package. Therefore, the HB56D136 makes high density mounting possible without surface mount technology. The HB56D136 provides mon data inputs and outputs. Decoupling capacitors are mounted beneath each SOJ. Features - 72-pin - Lead pitch: 1.27 mm - Single 5 V (±5%) supply - High speed - Access time: 60 ns/70 ns/80 ns (max) - Low power dissipation - Active mode: 5.46 W/4.94 W/4.41 W (max) - Standby mode: 105 m W (max) 5.25 m W (max) (L-version) - Fast page mode capability - 1,024 refresh cycle: 16 ms 128 ms (L-version) - 3 variations of refresh - RAS only refresh - CAS-before-RAS refresh - Hidden refresh - TTL patible HB56D136 Series Ordering Information Type No. HB56D136BW-6C HB56D136BW-7C HB56D136BW-8C HB56D136BW-6CL HB56D136BW-7CL HB56D136BW-8CL HB56D136SBW-6C HB56D136SBW-7C HB56D136SBW-8C HB56D136SBW-6CL HB56D136SBW-7CL HB56D136SBW-8CL Access Time 60 ns 70 ns 80 ns 60 ns 70 ns 80 ns 60 ns 70 ns 80 ns 60 ns 70 ns 80 ns Package 72-pin SIP socket type Contact Pad Gold 72-pin SIP socket type Solder Pin Arrangement HB56D136 Series Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 Pin Name VSS DQ0 DQ18 DQ1 DQ19 DQ2 DQ20 DQ3 DQ21 VCC NC A0 A1 A2 A3 A4 A5 A6 1 pin 36 pin 37 pin 72 pin Pin No. 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 Pin Name NC DQ4 DQ22 DQ5 DQ23 DQ6 DQ24 DQ7 DQ25 A7 NC VCC A8 A9 NC RAS2 DQ26 DQ8 Pin No. 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53...