HB56D473EJ-7 Datasheet | Hitachi Semiconductor

Description The HB56D473EJ belongs to 8 Byte DIMM (Dual In-line Memory Module) family, and has been developed as an optimized main memory solution for 4 and 8 Byte processor applications. The HB56D473EJ is a 4M × 72 dynamic RAM module, mounted 16 pieces of 16-Mbit DRAM (HM5117400) sealed in SOJ package and 8 pieces of 4-Mbit DRAM (HM514100) sealed in SOJ package, 1 pieces of 16bit Bi CMOS line driver (74ABT16244) sealed in TSSOP package and 1 pieces of 20-bit Bi CMOS line driver (74ABT16827) sealed in TSSOP package. An outline of the HB56D473EJ is 168-pin socket type package (dual lead out). Therefore, the HB56D473EJ makes high density mounting possible without surface mount technology. The HB56D473EJ provides mon data inputs and outputs. Decoupling capacitors are mounted on the module board. Features - 168-pin socket type package (Dual lead out)  Outline: 133.35 mm (Length) × 25.40 mm (Height) × 9.00 mm (Thickness)  Lead pitch: 1.27 mm - Single 5 V (±5%) supply - High speed  Access time: t RAC = 60/70 ns (max) t CAC = 20/25 ns (max) - Low power dissipation  Active mode: 12.5/11.3 W (max)  Standby mode (TTL): 588 m W (max) (CMOS): 462 m W (max) - Buffered input except RAS and DQ - 4 byte interleave enabled, dual address input (A0/B0) - JEDEC standard outline buffered 8-byte DIMM - Fast page mode capability - 2,048 refresh cycles: 32 ms HB56D473EJ Series - 2 variations of refresh  RAS-only refresh  CAS-before-RAS refresh - TTL patible Ordering Information Type No. HB56D473EJ-6 HB56D473EJ-7 Access time 60 ns 70 ns Package 168-pin dual lead out socket type Contact pad Gold Pin Arrangement Front side Back side 1 pin 10 pin 11 pin 85 pin 94 pin 95 pin 40 pin 41 pin 124 pin 125 pin 84 pin 168 pin Pin Arrangement Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 Pin name VSS DQ0 DQ1 DQ2 DQ3 VCC DQ4 DQ5 DQ6 DQ7 DQ8 VSS DQ9 DQ10 DQ11 DQ12 DQ13 VCC DQ14 DQ15 DQ16 DQ17 VSS NC NC VCC WE0 CE0 CE2 RE0 OE0 VSS A0...