IXFK32N60 Description
IXFK 32N60 IXFK 36N60 Preliminary Data IXFN 32N60 .. 300 Test Conditions TJ = 25 °C to 150°C TJ = 25 °C to 150°C;.
IXFK32N60 Key Features
- International standard packages
- JEDEC TO-264 AA, epoxy meet UL 94 V-0, flammability classification
- miniBLOC with Aluminium nitride isolation
- Low RDS (on) HDMOSTM process
- Rugged polysilicon gate cell structure
- Unclamped Inductive Switching (UIS) rated
- Low package inductance
- Fast intrinsic Rectifier