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IXGQ90N27PB - IGBT

Key Features

  • Maximum lead temperature for soldering 1.6 mm (0.062 in. ) from case for 10 s Maximum plastic body temperature for 10 S Mounting torque 300 260 1.3/10 5.5.
  • International standard package.
  • Low VCE(sat).
  • - for minimum on-state conduction losses MOS Gate turn-on - drive simplicity.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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Preliminary Technical Information PolarTM www.DataSheet4U.com IGBT for PDP Applications IXGQ90N27PB VCES = = ICP VCE(sat) ≤ 270 V 340 A 2.1 V Symbol Test Conditions Maximum Ratings TO-3P VCES VGEM IC25 ICPEAK I C(RMS) SSOA (RBSOA) PC TJ TJM Tstg TL TSOLD Md Weight TJ = 25°C to 150°C 270 ±30 V V A A A A G C E (TAB) TC = 25°C, IGBT chip capability TJ ≤ 150°C, tp ≤ 1 μs, D ≤ 1% Lead current limit VGE = 15 V, TVJ = 150°C, RG = 20 Ω Clamped inductive load, VCE < 270 V TC = 25°C 90 340 75 ICM = 90 150 -55 ... +150 150 -55 ... +150 G = Gate E = Emitter C = Collector TAB = Collector W °C °C °C °C °C Nm/lb.in. g Features Maximum lead temperature for soldering 1.6 mm (0.062 in.) from case for 10 s Maximum plastic body temperature for 10 S Mounting torque 300 260 1.3/10 5.