IXTF02N450 Description
+150 C Maximum Lead Temperature for Soldering Plastic Body for 10s 300 °C 260 °C Mounting Force 20..120 / 4.5..27 N/lb. 50/60Hz, 1 Minute 4500 V~ 6 g Symbol Test Conditions (TJ = 25C, Unless Otherwise Specified) Characteristic Values Min.
IXTF02N450 Key Features
- Silicon Chip on Direct-Copper Bond (DCB) Substrate
- Isolated Mounting Surface
- 4500V~ Electrical Isolation
- Molding Epoxies meet UL 94 V-0
- High Voltage Package
- Easy to Mount
- Space Savings
- High Power Density