IXYF30N170CV1 Description
+175 °C Maximum Lead Temperature for Soldering 1.6 mm (0.062in.) from Case for 10s 300 °C 260 °C Mounting Force 20..120 / 4.5..27 Nm/lb.in.
IXYF30N170CV1 Key Features
- Silicon Chip on Direct-Copper Bond (DCB) Substrate
- Isolated Mounting Surface
- 2500V~ Electrical Isolation
- High Blocking Voltage
- High Peak Current Capability
- Low Saturation Voltage
- VCES, VGE = 0V
- Low Gate Drive Requirement
- High Power Density