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SIGC121T60NR2C
IGBT Chip in NPT-technology
FEATURES: • 600V NPT technology 100µm chip • positive temperature coefficient • easy paralleling • integrated gate resistor
This chip is used for: • IGBT Modules Applications: • drives
C
G
E
Chip Type
VCE
ICn 150A
Die Size 11 x 11 mm2
Package sawn on foil
Ordering Code Q67041-A4684A001
SIGC121T60NR2C 600V
MECHANICAL PARAMETER: Raster size Area total / active Emitter pad size Gate pad size Thickness Wafer size Flat position Max.possible chips per wafer Passivation frontside Emitter metallization Collector metallization Die bond Wire bond Reject Ink Dot Size Recommended Storage Environment 11 x 11 121 / 102.5 8x 6.2 x 2.55 mm
2
1.51 x 0.