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FS3L25R12W2H3_B11 - IGBT

Key Features

  • High speed IGBT H3.
  • Low inductive design.
  • Low switching losses Mechanical Features.
  • Al2O3 substrate with low thermal resistance.
  • Compact design.
  • PressFIT contact technology.
  • Rugged mounting due to integrated mounting clamps Module Label Code Barcode Code 128 DMX - Code prepared by: CM approved by: AKDA Content of the Code Module Serial Number Module Material Number Production Order Number Datecode (Production Year) Datecode (Produ.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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TechnischeInformation/TechnicalInformation IGBT-Modul IGBT-Module FS3L25R12W2H3_B11 EasyPACKModulmitschnellemTrench/FeldstoppIGBT4undEmitterControlled4DiodeundPressFIT/ NTC EasyPACKmodulewithfastTrench/FieldstopIGBT4andEmitterControlled4diodeandPressFIT/NTC VorläufigeDaten/PreliminaryData J VCES = 1200V IC nom = 25A / ICRM = 50A TypischeAnwendungen • 3-Level-Applikationen • SolarAnwendungen ElektrischeEigenschaften • HighSpeedIGBTH3 • NiederinduktivesDesign • NiedrigeSchaltverluste MechanischeEigenschaften • Al2O3 Substrat mit kleinem thermischen Widerstand • KompaktesDesign • PressFITVerbindungstechnik • Robuste Montage durch integrierte Befestigungsklammern TypicalApplications • 3-level-applications • Solarapplications ElectricalFea