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FS3L30R07W2H3F_B11 - IGBT

Features

  • CoolSiC (TM) Schottky diode gen 5.
  • High speed IGBT H3.
  • Low switching losses Mechanical Features.
  • 3 kV AC 1min insulation.
  • Al2O3 substrate with low thermal resistance.
  • Compact design.
  • PressFIT contact technology.
  • Rugged mounting due to integrated mounting clamps Module Label Code Barcode Code 128 DMX - Code Content of the Code Module Serial Number Module Material Number Production Order Number Datecode (Production Year) Da.

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Datasheet Details

Part number FS3L30R07W2H3F_B11
Manufacturer Infineon
File Size 956.65 KB
Description IGBT
Datasheet download datasheet FS3L30R07W2H3F_B11 Datasheet
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FS3L30R07W2H3F_B11 EasyPACKModulmitschnellemTrench/FeldstoppHigh-Speed3IGBTundSiCDiodeundPressFIT/NTC EasyPACKmodulewithfastTrench/FieldstopHigh-Speed3IGBTandSiCdiodeandPressFIT/NTC TypischeAnwendungen • 3-Level-Applikationen • Motorantriebe • SolarAnwendungen • USV-Systeme ElektrischeEigenschaften • CoolSiC(TM)SchottkyDiodeGen5 • HighSpeedIGBTH3 • NiedrigeSchaltverluste MechanischeEigenschaften • 3kVAC1minIsolationsfestigkeit • Al2O3 Substrat mit kleinem thermischen Widerstand • KompaktesDesign • PressFITVerbindungstechnik • Robuste Montage durch integrierte Befestigungsklammern J VCES = 650V IC nom = 30A / ICRM = 60A TypicalApplications • 3-level-applications • Motordrives • Solarapplications • UPSsystems ElectricalFeatures • CoolSiC
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