• Part: IGC193T120T8RM
  • Description: IGBT
  • Manufacturer: Infineon
  • Size: 378.46 KB
Download IGC193T120T8RM Datasheet PDF
Infineon
IGC193T120T8RM
IGC193T120T8RM is IGBT manufactured by Infineon.
Features and Applications...............................................................................................................................3 Mechanical Parameters....................................................................................................................................3 Maximum Ratings .............................................................................................................................................4 Static and Electrical Characteristics ..............................................................................................................4 Further Electrical Characteristics ...................................................................................................................5 Chip Drawing.....................................................................................................................................................6 Revision History ...............................................................................................................................................7 Relevant Application Notes .............................................................................................................................7 Legal Disclaimer ...............................................................................................................................................8 L7713O, L7713U Rev. 2.1, 20.08.2015 TRENCHSTOPTM IGBT4 Medium Power Chip Features : - 1200V trench & field stop technology - Low switching losses - Soft turn off - Positive temperature coefficient - Easy paralleling Remended for: - Medium power modules Applications: - Medium power drives Chip Type IGC193T120T8RM VCE 1200V ICn 1 200A Die Size 15.99mm x 12.08mm Package Sawn on foil Mechanical Parameters Die size Emitter pad size Gate pad size Area total Thickness Wafer size Maximum possible chips per wafer Passivation frontside Pad metal Backside...