Click to expand full text
SIDC161D170H
Fast switching diode chip in EMCON 3 -Technology
FEATURES:
A
• 1700V EMCON 3 technology 200 µm chip This chip is used for:
• soft, fast switching
• EUPEC power modules
• low reverse recovery charge
• small temperature coefficient
Applications:
C
• resonant applications, drives
Chip Type SIDC161D170H
VR
IF
Die Size
1700V 300A 12.7 x 12.7 mm2
Package Ordering Code
sawn on foil
Q67050-A4180A001
MECHANICAL PARAMETER: Raster size Area total / active Anode pad size Thickness Wafer size Flat position Max. possible chips per wafer Passivation frontside Anode metallization
Cathode metallization
Die bond Wire bond Reject Ink Dot Size
Recommended Storage Environment
12.7 x 12.7 161.29 / 137.69
mm2
10.68 x 10.
SIDC161D170H Datasheet
