IRF6794MPbF Overview
The IRF6794MPbF bines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.7 mm profile. The DirectFET package is patible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques. Application...
IRF6794MPbF Key Features
- RoHs pliant Containing No Lead and Bromide
- Integrated Monolithic Schottky Diode Typical values (unless otherwise specified) VDSS VGS RDS(on) RDS(on)
- Dual Sided Cooling patible
- Low Package Inductance
- Optimized for High Frequency Switching Qg tot 31nC Qgd 11nC Qgs2 4.4nC Qrr 51nC Qoss Vgs(th) 27nC 1.8V
- Ideal for CPU Core DC-DC Converters
- Optimized for Sync. FET socket of Sync. Buck Converter
- Low Conduction and Switching Losses