AUIRL1404ZS Overview
Key Specifications
Package: D2PAK
Mount Type: Surface Mount, Through Hole
Pins: 3
Height: 9.65 mm
Description
Specifically designed for Automotive applications, this HEXFET® Power MOSFET utilizes the latest D DD processing techniques to achieve extremely low onresistance per silicon area. Additional features of this design are a 175°C junction operating temperature, fast switching speed and improved repetitive avalanche rating.
Key Features
- 2.5mΩ l Fast Switching l Repetitive Avalanche Allowed up to Tjmax l Lead-Free, RoHS Compliant G max
- 3.1mΩ lÃID (Silicon Limited) 180A l Automotive Qualified * S ID (Package Limited) 160A
