JANKCE1N5802 Overview
Key Features
- Chip Outline Dimensions: 41 x 41 mils Chip Thickness: 8 to 12 mils Anode Metallization: Aluminum Metallization Thickness: 50,000Ã Nominal Bonding Area: 23 x 23 mils Min. Back Metallization: Gold Junction Passivated with Thermal Silicon Dioxide
- Planar Design Backside Available with Solderable Ag Backside as JANHCF or JANKCF
