JANKCE1N5809 Overview
Key Features
- Chip Outline Dimensions: 68 x 68 mils Chip Thickness: 8 to 12 mils Anode Metallization: Aluminum Metallization Thickness: 70,000Ã Nominal Bonding Area: 42 x 42 mils Min. Back Metallization: Gold-3000Ã Nominal Junction Passivated with Thermal Silicon Dioxide
- Planar Design Backside Available with Solderable Ag Backside as JANHCF or JANKCF
