• Part: MM002-08
  • Manufacturer: Microsemi
  • Size: 97.44 KB
Download MM002-08 Datasheet PDF
MM002-08 page 2
Page 2

MM002-08 Description

SYMBOL CONDITIONS MIN TYP. IR(rec)= 0.25A µsec nsec Junction Capacitance Cj VR= 10 Vdc; Vsig= 50 mV(pp) ,max pF Notes (1) Pulse test, t ≤ 300 µs, duty cycle δ ≤.

MM002-08 Key Features

  • Available in standard switching (low VF) as MM002-xx or ultrafast switching as MM002-xxU
  • pact and rugged construction offering weight and space savings
  • Available with PC board solderable pins (see mechanical outline below) or threaded terminals (add “ T”suffix to part num
  • HPM (Hermetic Power Module)
  • Isolation voltage capability (in reference to the base) in excess of 3kV
  • Very low thermal resistance
  • Thermally matched construction provides excellent temperature and power cycling capability
  • Additional voltage ratings or terminations available upon request