• Part: SOT263
  • Description: Package outline
  • Manufacturer: NXP Semiconductors
  • Size: 10.01 KB
Download SOT263 Datasheet PDF
NXP Semiconductors
SOT263
SOT263 is manufactured by NXP Semiconductors.
PDF: 1999 Apr 16 Philips Semiconductors Package outline Plastic single-ended package; heatsink mounted; 1 moumting hole; 5-lead TO-220 A A1 q D1 D mounting base L3 m L L2 L1 Q 1 e b 5 w M c 5 scale 10 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 4.5 4.1 A1 1.39 1.27 b 0.9 0.7 c 0.7 0.4 D 15.8 15.2 D1 6.4 5.9 E 10.3 9.7 e 1.7 L 15.0 13.5 L1 (1) L2 (2) L3 max. 3.5 (3) m 0.8 0.6 P 3.8 3.6 q 3.0 2.7 Q 2.6 2.2 w 0.4 2.4 1.6 Notes 1. Terminal dimensions are uncontrolled in this zone. 2. Positional accuracy of the terminals is controlled in this zone. 3. Terminals in this zone are not tinned. OUTLINE VERSION SOT263 REFERENCES IEC JEDEC...