Datasheet Details
| Part number | SOT263 |
|---|---|
| Manufacturer | NXP Semiconductors |
| File Size | 10.01 KB |
| Description | Package outline |
| Datasheet | SOT263_PhilipsSemiconductors.pdf |
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Overview: PDF: 1999 Apr 16 Philips Semiconductors Package outline Plastic single-ended package; heatsink mounted; 1 moumting hole; 5-lead TO-220 SOT263 E P A A1 q D1 D mounting base L3 m L L2 L1 Q 1 e b 5 w M.
| Part number | SOT263 |
|---|---|
| Manufacturer | NXP Semiconductors |
| File Size | 10.01 KB |
| Description | Package outline |
| Datasheet | SOT263_PhilipsSemiconductors.pdf |
|
|
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| Part Number | Description |
|---|---|
| SOT27-1 | Package outline |
| SOT1061 | plastic thermal enhanced ultra thin small outline package |
| SOT109-1 | Package outline |
| SOT1699-1 | low profile quad flat package |
| SOT313-2 | LQFP48 Reel pack Packing information |
| SOT314-2 | Packing information |
| SOT353 | plastic surface-mounted package |
| SOT363 | Plastic surface-mounted package |
| SOT407-1 | plastic low profile quad flat package |
| SOT414-1 | plastic low profile quad flat package |