SOT263 Description
1999 Apr 16 Philips Semiconductors Package outline Plastic single-ended package; Terminal dimensions are uncontrolled in this zone. Positional accuracy of the terminals is controlled in this zone.
SOT263 is Package outline manufactured by NXP Semiconductors.
| Part Number | Description |
|---|---|
| SOT27-1 | Package outline |
| SOT1061 | plastic thermal enhanced ultra thin small outline package |
| SOT109-1 | Package outline |
| SOT1699-1 | low profile quad flat package |
| SOT313-2 | LQFP48 Reel pack Packing information |
1999 Apr 16 Philips Semiconductors Package outline Plastic single-ended package; Terminal dimensions are uncontrolled in this zone. Positional accuracy of the terminals is controlled in this zone.