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PDF: 1999 Apr 16
Philips Semiconductors
Package outline
Plastic single-ended package; heatsink mounted; 1 moumting hole; 5-lead TO-220
SOT263
E P
A A1 q
D1
D
mounting base
L3 m L L2
L1 Q
1
e b
5
w M c
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 4.5 4.1 A1 1.39 1.27 b 0.9 0.7 c 0.7 0.4 D 15.8 15.2 D1 6.4 5.9 E 10.3 9.7 e 1.7 L 15.0 13.5 L1
(1)
L2
(2)
L3 max. 3.5
(3)
m 0.8 0.6
P 3.8 3.6
q 3.0 2.7
Q 2.6 2.2
w 0.4
2.4 1.6
0.5
Notes 1. Terminal dimensions are uncontrolled in this zone. 2. Positional accuracy of the terminals is controlled in this zone. 3. Terminals in this zone are not tinned.