Datasheet Details
| Part number | SOT27-1 |
|---|---|
| Manufacturer | NXP Semiconductors |
| File Size | 9.10 KB |
| Description | Package outline |
| Datasheet | SOT27-1_PhilipsSemiconductors.pdf |
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Overview: PDF: 2003 Feb 18 Philips Semiconductors Package outline DIP14: plastic dual in-line package; 14 leads (300 mil) SOT27-1 D seating plane ME A2 A L A1 c Z e b1 b 14 8 MH w M (e 1) pin 1 index E 1 7 0.
| Part number | SOT27-1 |
|---|---|
| Manufacturer | NXP Semiconductors |
| File Size | 9.10 KB |
| Description | Package outline |
| Datasheet | SOT27-1_PhilipsSemiconductors.pdf |
|
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| Part Number | Description |
|---|---|
| SOT263 | Package outline |
| SOT1061 | plastic thermal enhanced ultra thin small outline package |
| SOT109-1 | Package outline |
| SOT1699-1 | low profile quad flat package |
| SOT313-2 | LQFP48 Reel pack Packing information |
| SOT314-2 | Packing information |
| SOT353 | plastic surface-mounted package |
| SOT363 | Plastic surface-mounted package |
| SOT407-1 | plastic low profile quad flat package |
| SOT414-1 | plastic low profile quad flat package |