TDA8591J
Description
to soldering through-hole mount packages Soldering by dipping or by solder wave Manual soldering Suitability of through-hole mount IC packages for dipping and wave soldering methods DATA SHEET STATUS DEFINITIONS DISCLAIMERS 2002 Jan 14 2 Philips Semiconductors Preliminary specification 4 × 44 W into 4 Ω or 4 × 75 W into 2 Ω quad BTL car radio power amplifier.
Key Features
- All outputs can withstand short-circuits to ground, to the positive supply voltage and across the load
- ESD protection on all pins
- Thermal protection against junction temperatures exceeding 150 °C
- Load dump protection
- Protected against open ground pins (loss of ground) and outputs short-circuited to supply ground
- All negative outputs are protected against open supply voltage and output short-circuited to supply voltage
- Reverse-polarity safe. 2 GENERAL DESCRIPTION
- Low quiescent current
- Low distortion
- Low output offset voltage
