FEATURES
High Speed (Equal Access and Cycle Times) – 12/15/20/25/35 ns (Commercial) – 15/20/25/35/45 ns (Industrial) – 20/25/35/45/55/70 ns (Military) Low Power Single 5V±10% Power Supply Easy Memory Expansion Using CE and OE Inputs Common Data I/O Three-State Outputs Fully TTL Compatible Inputs and Outputs Advanced CMOS Technology Fast tOE Automatic Power Down Packages – 28-Pin 300 mil DIP, SOJ, TSOP – 28-Pin 300 mil Ceramic DIP – 28-Pin 600 mil Plastic and Ceramic DIP – 28-Pin CERPACK – 28-Pin Solder Seal Flat Pack – 28-Pin SOP – 28-Pin LCC (350 mil x 550 mil) – 32-Pin LCC (450 mil x 550 mil) DESCRIPTION
Inputs are fully TTL-compatible. Access time