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RBN40N65T1UFWA - IGBT

General Description

and application examples.

Key Features

  • Renesas generation 8th Trench IGBT.
  • Low collector to emitter saturation voltage VCE(sat) = 1.5 V typ. (at IC = 40 A, VGE = 15 V, Ta = 25 C).
  • High speed switching.

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Full PDF Text Transcription (Reference)

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RBN40N65T1UFWA 650V - 40A - IGBT Features  Renesas generation 8th Trench IGBT  Low collector to emitter saturation voltage VCE(sat) = 1.5 V typ. (at IC = 40 A, VGE = 15 V, Ta = 25 C)  High speed switching  Applications: UPS, Welding, photovoltaic inverters, Power converter system  Unsawn wafer Wafer size: 200 mm  Quality grade: Standard Datasheet R07DS1496EJ0120 Rev.1.20 Oct.18th.2024 Key performance Product name RBN40N65T1UFWA VCES 650 V IC 40 A Die size 13.69 mm2 (3.70 mm x 3.70 mm) Package Unsawn wafer Outline 2 C G 1 E 3 1. Gate 2. Collector (The back) 3. Emitter Die 2 1 3 Wafer Mechanical parameter Chip size Area total Thickness Wafer size Passivation frontside Pad metal Backside metal 3.70 x 3.70 13.69 0.075 typ. 193.9 Polyimide AlSi 5.