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RJP30H2A - Silicon N-Channel IGBT

Key Features

  • Trench gate and thin wafer technology (G6H-II series).
  • Low collector to emitter saturation voltage: VCE(sat) = 1.4 V typ.
  • High speed switching: tf = 100 ns typ, tf = 180 ns typ.
  • Low leak current: ICES = 1 A max Outline.

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Datasheet Details

Part number RJP30H2A
Manufacturer Renesas
File Size 226.18 KB
Description Silicon N-Channel IGBT
Datasheet download datasheet RJP30H2A Datasheet

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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Preliminary Datasheet RJP30H2DPK-M0 / RJP30H2A Silicon N Channel IGBT High speed power switching R07DS0467EJ0200 Rev.2.00 Jun 15, 2011 Features  Trench gate and thin wafer technology (G6H-II series)  Low collector to emitter saturation voltage: VCE(sat) = 1.4 V typ  High speed switching: tf = 100 ns typ, tf = 180 ns typ  Low leak current: ICES = 1 A max Outline RENESAS Package code: PRSS0004ZH-A (Package name: TO-3PSG) 4 C 1 23 1. Gate 2. Collector G 3. Emitter 4. Collector (Flange) E Absolute Maximum Ratings Item Collector to Emitter voltage Gate to Emitter voltage Collector current Collector peak current Collector dissipation Junction to case thermal impedance Junction temperature Storage temperature Notes: 1. PW  10 s, duty cycle  1% 2. Tc = 25C www.DataSheet.co.