DAN217UFH
Features
1) Ultra small mold type. (UMD3)
2) High reliability.
2.0±0.2 0.3±0.1 各リE同aーc寸hド法leとadもhas same dimension 0.15±0.05
(3)
- Construction Silicon epitaxial planar
(2)
（0.65） （0.65） 1.3±0.1
(1)
0～0.1
0.7±0.1 0.9±0.1
ROHM : UMD3 JEDEC : SOT-323 JEITA : SC-70 dot (year week factory)
- Taping specifications (Unit : mm)
4.0±0.1
2.0±0.05
φ1.55±0.05
1.25±0.1 2.1±0.1 0.1Min
0.9MIN. 1.6
Data Sheet
AEC-Q101 Qualified
- Land size figure (Unit : mm) 1.3
0.8MIN UMD3
- Structure
0.3±0.1
1.75±0.1
8.0±0.2
3.5±0.05
2.4±0.1
2.4±0.1
5.5±0.2
0～0.1
- Absolute maximum ratings (Ta=25°C)
Parameter
Symbol
Reverse voltage (repetitive peak) Reverse voltage (DC) Forward current (Single)
VRM VR IFM
Average rectified forward current (Single)
Io
Surge current (t=1us) Power...
