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KFG2G16Q2M Datasheet 2Gb OneNAND M-Die

Manufacturer: Samsung Semiconductor

Overview: OneNAND2G(KFG2G16Q2M-DEBx) OneNAND4G(KFH4G16Q2M-DEBx) OneNAND8G(KFW8G16Q2M-DEBx) FLASH MEMORY www.DataSheet4U.com KFG2G16Q2M KFH4G16Q2M KFW8G16Q2M 2Gb OneNAND M-die INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL INFORMATION IN THIS DOCUMENT IS PROVIDED ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND. 1. For updates or additional information about Samsung products, contact your nearest Samsung office. 2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where Product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. OneNAND¥‚ is a trademark of Samsung Electronics Company, Ltd. Other names and brands may be claimed as the property of their rightful owners. * Samsung Electronics reserves the right to change products or specification without notice. 1 OneNAND2G(KFG2G16Q2M-DEBx) OneNAND4G(KFH4G16Q2M-DEBx) OneNAND8G(KFW8G16Q2M-DEBx) FLASH MEMORY Revision History Document Title OneNAND Revision History Revision No. History www.DataSheet4U.com 0.0 0.1 1. Initial issue. Draft Date Mar. 30, 2006 Remark Advanced Preliminary 1. Corrected errata. Aug., 3, 2006 2. Changed a tem from MAT to Plane. 3. Chapter 1.4 & 2.3 & 8.0 : Revised the package size from 11x13 to 10x13. 4. Chapter 2.

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General Description

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5.

Chapter 2.8.3 : Eliminated ’Top boot’ option.

Key Features

  • including: xA BootRAM and bootloader xTwo independent bi-directional 2KB DataRAM buffers xA High-Speed x16 Host Interface xOn-chip Error Correction xOn-chip NOR interface controller This on-chip integration enables system designers to reduce external system logic and use high-density NAND Flash in.

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