SMG2392N Overview
Description
These miniature surface mount MOSFETs utilize a High Cell Density trench process to provide Low RDS(on) and to ensure minimal power loss and heat dissipation. Typical applications are A L 3 SC-59 3 Top View C B 1 2 2.
Key Features
- Low RDS(on) provides higher efficiency and extends battery life
- Low thermal impedance copper lead frame SC-59 saves board space
- Fast switching speed
- High performance trench technology
- A B C D E F G Millimeter Min
