SMG2302N Overview
Description
These miniature surface mount MOSFETs utilize a High Cell Density trench process to provide Low RDS(on) and to ensure minimal power loss and heat dissipation. Typical applications are.
Key Features
- Low RDS(on) provides higher efficiency and extends battery life
- Low thermal impedance copper lead frame SC-59 saves board space
- Fast switching speed
- High performance trench technology
