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SMG2302N Description

These miniature surface mount MOSFETs utilize a High Cell Density trench process to provide Low RDS(on) and to ensure minimal power loss and heat dissipation.

SMG2302N Key Features

  • Low RDS(on) provides higher efficiency and extends battery life
  • Low thermal impedance copper lead frame SC-59 saves board space
  • Fast switching speed
  • High performance trench technology

SMG2302N Applications

  • Low RDS(on) provides higher efficiency and extends battery life