Datasheet Summary
LRS1341/LRS1342
Data Sheet
Features
- Flash Memory and SRAM
- Stacked Die Chip Scale Package
- 72-ball CSP (FBGA072-P-0811) plastic package
- Power supply: 2.7 V to 3.6 V
- Operating temperature: -25°C to +85°C
- Flash Memory
- Access time (MAX.): 100 ns
- Operating current (MAX.): The current for F-VCC pin
- Read: 25 mA (tCYCLE = 200 ns)
- Word write: 17 mA
- Block erase: 17 mA
- Deep power down current (the current for F-VCC pin): 10 µA (MAX. F-CE ≥ F-VCC
- 0.2 V, F-RP ≤-0.2 V, F-VPP ≤0.2 V)
- Optimized array blocking architecture
- Two 4K-word boot blocks
- Six 4K-word parameter blocks
Stacked Chip 16M Flash Memory and 2M SRAM
- Thirty-one 32K-word main blocks
- Top/Bottom boot...