SiZF5302DT Datasheet | Vishay

FEATURES - Trench FET® Gen V power MOSFET - Symmetric dual N-channel - Flip chip technology optimal thermal design - High side and low side MOSFETs form optimized bination for 50 % duty cycle - Optimized RDS - Qg and RDS - Qgd FOM elevates efficiency for high frequency switching - 100 % Rg and UIS tested - Material categorization: for definitions of pliance please see .vishay./doc?99912 APPLICATIONS - Synchronous buck - puter / server peripherals - Half bridge - POL - Tele DC/DC V+ N-Channel 1 MOSFET LSG N-Channel 2 MOSFET GND ORDERING INFORMATION Package Lead (Pb)-free and halogen-free Power PAIR 3 x 3FS Si ZF5302DT-T1-RE3 ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted) PARAMETER SYMBOL Drain-source voltage Gate-source voltage Continuous drain current (TJ = 150 °C) Pulsed drain current (t = 100 μs) Continuous source current (MOSFET diode conduction) Single pulse avalanche current Single pulse avalanche energy Maximum power dissipation Operating junction and storage temperature range Soldering remendations (peak temperature) TC = 25 °C TC = 70 °C TA = 25 °C TA = 70 °C TC = 25 °C TA = 25 °C L = 0.1 m H TC = 25 °C TC = 70 °C TA = 25 °C TA = 70 °C VDS...