VSSB310 - Surface Mount Trench MOS Barrier Schottky Rectifier

Vishay

Key Features

Low profile package TMBS ®.
Ideal for automated placement.
Trench MOS Schottky technology.
Low power losses, high efficiency.
Low forward voltage drop.
Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C.
Compliant to RoHS directive 2002/95/EC accordance to WEEE 2002/96/EC and in DO-214AA (SMB).

VSSB310 surface mount trench mos barrier schottky rectifier by Vishay - Datasheet Preview

Datasheet Details

Part number	VSSB310
Manufacturer	Vishay
File Size	151.09 KB
Description	Surface Mount Trench MOS Barrier Schottky Rectifier
Datasheet	VSSB310 Datasheet

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www.DataSheet.co.kr New Product VSSB310 Vishay General Semiconductor Surface Mount Trench MOS Barrier Schottky Rectifier FEATURES • Low profile package TMBS ® • Ideal for automated placement • Trench MOS Schottky technology • Low power losses, high efficiency • Low forward voltage drop • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • Compliant to RoHS directive 2002/95/EC accordance to WEEE 2002/96/EC and in DO-214AA (SMB) TYPICAL APPLICATIONS PRIMARY CHARACTERISTICS IF(AV) VRRM IFSM EAS VF at IF = 3.0 A TJ max. 3.0 A 100 V 80 A 50 mJ 0.56 V 150 °C For use in low voltage, high frequency inverters, freewheeling, dc-to-dc converters, and polarity protection applications.