WILLAS 2SB1260
Plastic-Encapsulate Transistors
FEATURES
● Batch process design, excellent power dissipation offers TRANSbISetTteOr rRev(ePrsNePle)akage current and thermal resistance. FEATU● RLoEwSprofile surface mounted application in order to z optimize board space. Po● wLoewr pTorwaenrsliosstso,rhigh efficiency. z H●igHhigVhoclutarrgeent acanpdabCiluitryr,elonwt forward voltage drop. z Lo●●wGHiuCgahordsllrueirncggetofocrar-epoavmebiritlvittoeyl.rtasgaetpurroatteicotnionv.oltage z Pb● -UFltrreaehigpha-cspkeaegdeswisitcahivnag.ilable Ro● HSiSlicopnroedpiutacxtiafol prlapnaacrkcihnipg, cmoedtael ssiluicfofinxju”Gnc”tion.● Lead-free parts meet environmental standards of HalMogILe-SnTfDre-1e95p0r0o/d2u2c8t for packing code suffix “H”
● RoHS product for packing code suffix "G" Halogen free product for packing code suffix "H" Mechan