2SB1386
Overview
- SBbTeaOtttceRhr pr(erPovcNeerPsses) design, excellent power dissipation offer leakage current and thermal resistance. s FEATUR
- LEoopSwtimpirzoefibleosaurdrfaspcea moun ce. ted ap plicati on in order to z Low
- Lcoowllepocwtoerr sloastsu, rhaigtihoenffvicoieltnacgy.e z Exe *
- cHHlliieggnhh ,nlocwhfaorrawcatredrvisotltiacgse drop. z Pb-
- FGreuearpdraincgkfaogr oeviesrvaovltaagileapbrloetection. RoH
- SUltprarohdiguhc-tspfoeredpaswckiticnhgincgo. de suffix ”G”
- Silicon epitaxial planar chip, metal silicon junction. Hal
- ogLeeandf-rfreeee pparortdsumceteftoernpvairconkminegnctaol dsteansduaffridxs“oHf ”
