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HAS530M12BM3T - 1200V 530A Half-Bridge Module

Download the HAS530M12BM3T datasheet PDF. This datasheet also covers the HAS530M12BM3 variant, as both devices belong to the same 1200v 530a half-bridge module family and are provided as variant models within a single manufacturer datasheet.

Key Features

  • Industry Standard 62 mm Footprint.
  • Housing CTI ≥ 600 (Material Group I).
  • Compliant with EN45545-2 R22/23 HL3.
  • High Humidity Operation THB-80 (HV-H3TRB).
  • Low Inductance Design Optimized for SiC.
  • Ultra Low Loss, High-Frequency Operation.
  • Normally-off, Fail-safe Device Operation C.
  • Copper Baseplate and Aluminum Nitride Insulator VDS IDS4 1200 V 3 530 A 2 V+ G1 K1 Mid G2 K2 V- Typical.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (HAS530M12BM3-Wolfspeed.pdf) that lists specifications for multiple related part numbers.

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
HAS530M12BM3, 5 HAS530M12BM3T 1200 V, 530 A, Silicon Carbide, Half-Bridge Module D Technical Features • Industry Standard 62 mm Footprint • Housing CTI ≥ 600 (Material Group I) • Compliant with EN45545-2 R22/23 HL3 • High Humidity Operation THB-80 (HV-H3TRB) • Low Inductance Design Optimized for SiC • Ultra Low Loss, High-Frequency Operation • Normally-off, Fail-safe Device Operation C • Copper Baseplate and Aluminum Nitride Insulator VDS IDS4 1200 V 3 530 A 2 V+ G1 K1 Mid G2 K2 V- Typical Applications • Railway Auxiliary & Traction • Induction Heating • Motor Drives • Renewables • EV Fast Charging • UPS and SMPS System Benefits 3 • 62 mm Form Factor Enables System Retrofit • Increased System Efficiency, due to Low Switching & Conduction Losses of SiC • Zero RBever