ZXMN6A25K Datasheet | Zetex Semiconductors

Description This new generation trench MOSFET from Zetex features a unique structure bining the benefits of low on-resistance and fast switching, making it ideal for high efficiency power management applications. Features - - .. Low on-resistance Fast switching speed Low gate drive DPAK package - - Applications - - - - DC-DC converters Power management functions Disconnect switches Motor control Ordering information Device ZXMN6A25KTC Reel size (inches) 13 Tape width (mm) 16 Quantity per reel 2,500 G S Pinout - top view Device marking ZXMN 6A25 Issue 3 - Novmber 2006 © Zetex Semiconductors plc 2006 .zetex. Absolute maximum ratings Parameter Drain-source voltage Gate-source voltage Continuous drain current @ VGS= 10V; Tamb=25°C(b) @ VGS= 10V; Tamb=70°C(b) @ VGS= 10V; Tamb=25°C(a) Pulsed drain current(c) Continuous source current (body diode)(b) Pulsed source current (body diode)(c) Power dissipation at Tamb =25°C(a) Linear derating factor Power dissipation at Tamb =25°C(b) Linear derating factor Power dissipation at Tamb =25°C(d) Linear derating factor Operating and storage temperature range Tj, Tstg PD PD IDM IS ISM PD Symbol VDSS VGS ID Limit 60 ±20 10.7 8.6 7 36 11.8 36 4.25 34 9.85 78.7 2.11 16.8 -55 to +150 Unit V V A A A A A A W m W/°C W m W/°C W m W/°C °C Thermal resistance Parameter Junction to ambient(a) Junction to ambient(b) Junction to ambient(d) Symbol R⍜JA R⍜JA R⍜JA Limit 29.4 12.7 59.1 Unit °C/W °C/W °C/W NOTES: (a) For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in still air conditions. (b) For a device surface mounted on FR4 PCB measured at t Յ10 sec. (c) Repetitive rating 50mm x 50mm x 1.6mm FR4 PCB, D=0.02 pulse width=300␮s - pulse width limited by maximum junction temperature. (d) For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz. copper, in still air conditions. Issue 3 - Novmber 2006 © Zetex...