BCX55 Datasheet

The BCX55 is a SURFACE MOUNT NPN SILICON TRANSISTOR.

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Part NumberBCX55
ManufacturerCentral Semiconductor
Overview The CENTRAL SEMICONDUCTOR BCX54, BCX55, and BCX56 types are NPN Silicon Transistors manufactured by the epitaxial planar process, epoxy molded in a surface mount package, designed for high current ge. rwise noted) SYMBOL TEST CONDITIONS MIN TYP MAX ICBO ICBO IEBO BVCBO BVCBO BVCBO BVCEO BVCEO BVCEO VCE(SAT) VBE(ON) hFE hFE hFE VCB=30V 100 VCB=30V, TA=125°C 10 VEB=5.0V 100 IC=100µA (BCX54) 45 IC=100µA (BCX55) 60 IC=100µA (BCX56) 100 IC=10mA (BCX54) 45 IC=10mA.
Part NumberBCX55
DescriptionNPN Silicon AF Transistors
ManufacturerInfineon
Overview NPN Silicon AF Transistors • For AF driver and output stages • High collector current • Low collctor-emitter saturation voltage • Complementary types: BCX51...BCX53 (PNP) • Pb-free (RoHS compliant) pa. point1) RthJS ≤ 15 1For calculation of RthJA please refer to Application Note AN077 (Thermal Resistance Calculation) Unit - V A mA W °C Unit K/W 2 2011-09-19 BCX54
*- BCX56
* Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values min. typ. max. DC .
Part NumberBCX55
DescriptionNPN TRANSISTOR
ManufacturerRectron
Overview only. "Typical" parameters which may be included on RECTRON data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. Rectron Inc does not. 1. Complementary to BCX51,BCX52,BCX53 2. Power Dissipation of 500mW 3. High Stability and High Reliability SOT-89 Maximum Ratings & Thermal Characteristics ( Ratings at 25ć ambient temperature unless otherwise specified.) Parameters Symbol TYPE Unit BCX54 45 V Collector-Base Voltage VCBO .
Part NumberBCX55
DescriptionNPN medium power transistors
ManufacturerNXP Semiconductors
Overview NPN medium power transistor series in Surface-Mounted Device (SMD) plastic packages. Table 1. Product overview Type number[1] Package NXP BCP55 SOT223 BCX55 SOT89 BC55PA SOT1061 JEITA SC-73. and benefits
* High current
* Three current gain selections
* High power dissipation capability
* Exposed heatsink for excellent thermal and electrical conductivity (SOT89, SOT1061)
* Leadless very small SMD plastic package with medium power capability (SOT1061)
* AEC-Q101 qualified 1.3 Application.

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