4-Bump Datasheet | Specifications & PDF Download

MAX40002–MAX40005 nanoPower 4-Bump Comparator in Ultra-Tiny 0.73mm x 0.73mm WLP/SOT23 Packages General Description The MAX40002–MAX40005 tiny, singl

(3 views)

MAX40002–MAX40005 nanoPower 4-Bump Comparator in Ultra-Tiny 0.73mm x 0.73mm WLP/SOT23 Packages General Description The MAX40002–MAX40005 tiny, singl

(3 views)

Evaluation Kit Available Design Resources Tools and Models Support Click here to ask an associate for production status of specific part numbers.

(3 views)

05192 ULLC0402FC3.3C* thru Only One Name Means ProT ek’Tion™ ULLC0402FC24C* UNBUMPED LOW CAPACIT ANCE FLIP CHIP ARRA Y APPLICA TIONS ✔ Cellular Pho

(2 views)

SL2ICS2001DW/V1D I-CODE SLI Label IC bumped wafer specification on UV-tape Rev. 3.0 — 5 February 2008 150030 Product data sheet addendum PUBLIC 1.

(2 views)

19-5112; Rev 0; 1/10 www.DataSheet4U.com µP Supervisory Circuits in 4-Bump (1mm x 1mm) Chip-Scale Package General Description The MAX16072/MAX16073/

(2 views)

19-5112; Rev 0; 1/10 www.DataSheet4U.com µP Supervisory Circuits in 4-Bump (1mm x 1mm) Chip-Scale Package General Description The MAX16072/MAX16073/

(2 views)

19-5112; Rev 0; 1/10 www.DataSheet4U.com µP Supervisory Circuits in 4-Bump (1mm x 1mm) Chip-Scale Package General Description The MAX16072/MAX16073/

(2 views)

MASW-008902-000DIE Bumped GaAs SP3T Switch for WLAN 2.4 - 2.5 GHz Features • 802.11b/g and Bluetooth Applications • Insertion Loss: 0.60 dB typical •

(2 views)

05152 Only One Name Means ProTek’Tion™ 200W LOW CAPACITANCE UNBUMPED FLIP CHIP TVS ARRAY ULC0402FC3.3C - ULC0402FC36C DESCRIPTION The ULC0402FCxxC

(2 views)

MAX40002–MAX40005 nanoPower 4-Bump Comparator in Ultra-Tiny 0.73mm x 0.73mm WLP/SOT23 Packages General Description The MAX40002–MAX40005 tiny, singl

(2 views)

05192 ULLC0402FC05C* UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY APPLICATIONS ✔ Cellular Phones ✔ Personal Digital Assistant (PDA) ✔ Notebook Computers

(1 views)

05192 ULLC0402FC3.3C* thru Only One Name Means ProT ek’Tion™ ULLC0402FC24C* UNBUMPED LOW CAPACIT ANCE FLIP CHIP ARRA Y APPLICA TIONS ✔ Cellular Pho

(1 views)

05192 ULLC0402FC3.3C* thru Only One Name Means ProT ek’Tion™ ULLC0402FC24C* UNBUMPED LOW CAPACIT ANCE FLIP CHIP ARRA Y APPLICA TIONS ✔ Cellular Pho

(1 views)

05192 ULLC0402FC3.3C* thru Only One Name Means ProT ek’Tion™ ULLC0402FC24C* UNBUMPED LOW CAPACIT ANCE FLIP CHIP ARRA Y APPLICA TIONS ✔ Cellular Pho

(1 views)

05192 ULLC0402FC3.3C* thru Only One Name Means ProT ek’Tion™ ULLC0402FC24C* UNBUMPED LOW CAPACIT ANCE FLIP CHIP ARRA Y APPLICA TIONS ✔ Cellular Pho

(1 views)

05192 ULLC0402FC3.3C* thru Only One Name Means ProT ek’Tion™ ULLC0402FC24C* UNBUMPED LOW CAPACIT ANCE FLIP CHIP ARRA Y APPLICA TIONS ✔ Cellular Pho

(1 views)

AlGaAs Solder Bump Flip-Chip PIN Diode Features • Low Series Resistance, 4 Ω • Ultra Low Capacitance, 25 fF • High Switching Cutoff Frequency, 40 GHz

(1 views)

MADS-001317-1320AG GaAs Solder Bump Flip Chip Schottky Diode Features • Low Series Resistance, 4 Ω • Low Capacitance, 45 fF • High Cutoff Frequency

(1 views)

www.DataSheet4U.com www.DataSheet4U.com

(1 views)