Datasheet4U Logo Datasheet4U.com

SL2ICS2001DW

I-CODE SLI Label IC bumped wafer specification on UV-tape

SL2ICS2001DW General Description

This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC with UV-tape of I-CODE SLI Label ICs on an NXP C075EE process and is the base for delivery of tested I-CODE SLI Label ICs. 2. Ordering information Table 1. Ordering information Type nu.

SL2ICS2001DW Datasheet (160.53 KB)

Preview of SL2ICS2001DW PDF

Datasheet Details

Part number:

SL2ICS2001DW

Manufacturer:

NXP ↗

File Size:

160.53 KB

Description:

I-code sli label ic bumped wafer specification on uv-tape.
SL2ICS2001DW/V1D I-CODE SLI Label IC bumped wafer specification on UV-tape Rev. 3.0

* 5 February 2008 150030 Product data sheet addendum PU.

📁 Related Datasheet

SL2ICS2001V1D I-CODE SLI Label IC bumped wafer specification on UV-tape (NXP)

SL2009 Dual stage IF amplifier (Zarlink Semiconductor Inc)

SL200H120TL IGBT (Slkor)

SL2015 Full Band Satellite Tuner (Mitel Networks Corporation)

SL2017 Full Band Satellite Tuner (Mitel Networks Corporation)

SL2030 High Performance Broadband Mixer Oscillator (Mitel Networks Corporation)

SL2035 High Performance Broadband Downconverter (Mitel Networks Corporation)

SL2055 PREAMPLIFIER FOR REMOTE CONTROL USE (AUK corp)

SL20S120F FAST RECOVER DIODE (Slkor)

SL20T0081 SLS System Logic Semiconductor (System Logic Semiconductor)

TAGS

SL2ICS2001DW I-CODE SLI Label bumped wafer specification UV-tape NXP

Image Gallery

SL2ICS2001DW Datasheet Preview Page 2 SL2ICS2001DW Datasheet Preview Page 3

SL2ICS2001DW Distributor