Part number:
SL2ICS2001DW
Manufacturer:
File Size:
160.53 KB
Description:
I-code sli label ic bumped wafer specification on uv-tape.
Datasheet Details
Datasheet Details
Part number:
SL2ICS2001DW
Manufacturer:
File Size:
160.53 KB
Description:
I-code sli label ic bumped wafer specification on uv-tape.
SL2ICS2001DW, I-CODE SLI Label IC bumped wafer specification on UV-tape
This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC with UV-tape of I-CODE SLI Label ICs on an NXP C075EE process and is the base for delivery of tested I-CODE SLI Label ICs.
2.
Ordering information Table 1.
Ordering information Type nu
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