SL2ICS2001DW I-CODE SLI Label IC bumped wafer specification on UV-tape

NXP

Description

SL2ICS2001DW/V1D I-CODE SLI Label IC bumped wafer specification on UV-tape Rev.3.0 * 5 February 2008 150030 Product data sheet addendum PU.
This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC with UV-tape of I-CODE SLI Label ICs.

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Datasheet Specifications

Part number: SL2ICS2001DW
Manufacturer: NXP ↗
File Size: 160.53 KB
Datasheet: SL2ICS2001DW_NXP.pdf
Description: I-CODE SLI Label IC bumped wafer specification on UV-tape

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SL2ICS2001DW I-CODE SLI Label bumped wafer specification UV-tape NXP

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