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SL2ICS2001V1D

I-CODE SLI Label IC bumped wafer specification on UV-tape

SL2ICS2001V1D General Description

This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC with UV-tape of I-CODE SLI Label ICs on an NXP C075EE process and is the base for delivery of tested I-CODE SLI Label ICs. 2. Ordering information Table 1. Ordering information Type nu.

SL2ICS2001V1D Datasheet (160.53 KB)

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Datasheet Details

Part number:

SL2ICS2001V1D

Manufacturer:

NXP ↗

File Size:

160.53 KB

Description:

I-code sli label ic bumped wafer specification on uv-tape.
SL2ICS2001DW/V1D I-CODE SLI Label IC bumped wafer specification on UV-tape Rev. 3.0

* 5 February 2008 150030 Product data sheet addendum PU.

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SL2ICS2001V1D I-CODE SLI Label bumped wafer specification UV-tape NXP

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