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SL2ICS2001V1D - I-CODE SLI Label IC bumped wafer specification on UV-tape

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Part number SL2ICS2001V1D
Manufacturer NXP
File Size 160.53 KB
Description I-CODE SLI Label IC bumped wafer specification on UV-tape
Datasheet download datasheet SL2ICS2001V1D Datasheet
Note This datasheet PDF includes multiple part numbers: SL2ICS2001V1D, SL2ICS2001DW.
Please refer to the document for exact specifications by model.
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Description

This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC with UV-tape of I-CODE SLI Label ICs on an NXP C075EE process and is the base for delivery of tested I-CODE SLI Label ICs. Diameter: Thickness:

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