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< DIPIPM > SLIMDIP-L TRANSFER MOLDING TYPE INSULATED TYPE OUTLINE MAIN FUNCTION AND RATINGS  RC-IGBT inverter bridge for three phase DC-to-AC power

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< DIPIPM > SLIMDIP-S TRANSFER MOLDING TYPE INSULATED TYPE OUTLINE MAIN FUNCTION AND RATINGS  RC-IGBT inverter bridge for three phase DC-to-AC power

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BISS0001 PIR CONTROLLER BISS0001 GENERAL DESCRIPTION BISS0001 is a PIR (passive infra-red) controller, using analog mixing digital design technique a

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8P2S-A EIAJ Package Code SOP8-P-225-1.27 JEDEC Code – Weight(g) 0.07 Lead Material Cu Alloy Plastic 8pin 225mil SOP e b2 8 5 HE E e1 Recommen

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DA38 Series has a micro gap cut to an accuracy of several tens of microns in width for rapid response against induced lightning and electrostatic disc

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Notice: Some parametric limits are subject to change MITSUBISHI LASER DIODES ML9xx19 SERIES 2.5Gbps InGaAsP DFB LASER DIODE TYPE NAME ML925B19F / M

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Notice: Some parametric limits are subject to change MITSUBISHI LASER DIODES ML9xx19 SERIES 2.5Gbps InGaAsP DFB LASER DIODE TYPE NAME ML925B19F / M

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Notice: Some parametric limits are subject to change MITSUBISHI LASER DIODES ML9xx19 SERIES 2.5Gbps InGaAsP DFB LASER DIODE TYPE NAME ML925B19F / M

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< DIPIPM > PSS20S92F6-AG PSS20S92E6-AG TRANSFER MOLDING TYPE INSULATED TYPE OUTLINE MAIN FUNCTION AND RATINGS  3 phase DC/AC inverter  600V / 20A

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SOLOMON SYSTECH SEMICONDUCTOR TECHNICAL DATA SSD1603 Advance Information 132 x 64 Bistable Display Driver with Controller This document contains info

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BISS0001 Micro Power PIR Motion Detector IC =========================================== Features Low power CMOS technology (ideal for battery operated

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< DIPIPM > PSS20S92F6-AG PSS20S92E6-AG TRANSFER MOLDING TYPE INSULATED TYPE OUTLINE MAIN FUNCTION AND RATINGS  3 phase DC/AC inverter  600V / 20A

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