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Bump Datasheet, Features, Application

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MA-COM

MASW-008902-000DIE - Bumped GaAs SP3T Switch

MASW-008902-000DIE Bumped GaAs SP3T Switch for WLAN 2.4 - 2.5 GHz Features • 802.11b/g and Bluetooth Applications • Insertion Loss: 0.60 dB typical •.
1.0 · rating-1
MA-COM

MASW-009276-001DIE - Bumped GaAs SP3T Switch

MASW-009276-001DIE Bumped GaAs SP3T Switch for WLAN 1.0 - 4.0 GHz Rev. V2 Features • 802.11b/g and Bluetooth Applications • Low Insertion Loss: 0.5.
1.0 · rating-1
MA-COM

MASW-009276-000DIE - Bumped GaAs SP3T Switch

MASW-009276-000DIE Bumped GaAs SP3T Switch for WLAN 1.0 - 4.0 GHz Rev. V2 Features • 802.11b/g and Bluetooth Applications • Low Insertion Loss: 0.5.
1.0 · rating-1
MA-COM

MASW-009590-000DIE - Bumped GaAs SPDT Switch

MASW-009590-000DIE Bumped GaAs SPDT Switch DC - 8.0 GHz Features • 802.11a + b/g and MIMO Applications • Test and Measurement and Low/Medium Power Tel.
1.0 · rating-1
Protek Devices

ULLC0402FC05C - UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY

05192 ULLC0402FC05C* UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY APPLICATIONS ✔ Cellular Phones ✔ Personal Digital Assistant (PDA) ✔ Notebook Computers .
1.0 · rating-1
Protek Devices

ULLC0402FC08C - (ULLC0402FC3.3C - ULLC0402FC24C) UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY

05192 ULLC0402FC3.3C* thru Only One Name Means ProT ek’Tion™ ULLC0402FC24C* UNBUMPED LOW CAPACIT ANCE FLIP CHIP ARRA Y APPLICA TIONS ✔ Cellular Pho.
1.0 · rating-1
Protek Devices

ULLC0402FC3.3C - (ULLC0402FC3.3C - ULLC0402FC24C) UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY

05192 ULLC0402FC3.3C* thru Only One Name Means ProT ek’Tion™ ULLC0402FC24C* UNBUMPED LOW CAPACIT ANCE FLIP CHIP ARRA Y APPLICA TIONS ✔ Cellular Pho.
1.0 · rating-1
Protek Devices

ULLC0402FC05C - (ULLC0402FC3.3C - ULLC0402FC24C) UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY

05192 ULLC0402FC3.3C* thru Only One Name Means ProT ek’Tion™ ULLC0402FC24C* UNBUMPED LOW CAPACIT ANCE FLIP CHIP ARRA Y APPLICA TIONS ✔ Cellular Pho.
1.0 · rating-1
Protek Devices

ULLC0402FC12C - (ULLC0402FC3.3C - ULLC0402FC24C) UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY

05192 ULLC0402FC3.3C* thru Only One Name Means ProT ek’Tion™ ULLC0402FC24C* UNBUMPED LOW CAPACIT ANCE FLIP CHIP ARRA Y APPLICA TIONS ✔ Cellular Pho.
1.0 · rating-1
Protek Devices

ULLC0402FC15C - (ULLC0402FC3.3C - ULLC0402FC24C) UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY

05192 ULLC0402FC3.3C* thru Only One Name Means ProT ek’Tion™ ULLC0402FC24C* UNBUMPED LOW CAPACIT ANCE FLIP CHIP ARRA Y APPLICA TIONS ✔ Cellular Pho.
1.0 · rating-1
Protek Devices

ULLC0402FC24C - (ULLC0402FC3.3C - ULLC0402FC24C) UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY

05192 ULLC0402FC3.3C* thru Only One Name Means ProT ek’Tion™ ULLC0402FC24C* UNBUMPED LOW CAPACIT ANCE FLIP CHIP ARRA Y APPLICA TIONS ✔ Cellular Pho.
1.0 · rating-1
Tyco Electronics

MA4AGSBP907 - AlGaAs Solder Bump Flip-Chip PIN Diode

AlGaAs Solder Bump Flip-Chip PIN Diode Features • Low Series Resistance, 4 Ω • Ultra Low Capacitance, 25 fF • High Switching Cutoff Frequency, 40 GHz .
1.0 · rating-1
Tyco Electronics

MADS-001317-1320AG - GaAs Solder Bump Flip Chip Schottky Diode

MADS-001317-1320AG GaAs Solder Bump Flip Chip Schottky Diode Features • Low Series Resistance, 4 Ω • Low Capacitance, 45 fF • High Cutoff Frequency .
1.0 · rating-1
Premo

KGEA-BA - KEYLESS GO EMITTER BUMPER ANTENNA

www.DataSheet4U.com www.DataSheet4U.com .
1.0 · rating-1
NXP

SL2ICS2001DW - I-CODE SLI Label IC bumped wafer specification on UV-tape

SL2ICS2001DW/V1D I-CODE SLI Label IC bumped wafer specification on UV-tape Rev. 3.0 — 5 February 2008 150030 Product data sheet addendum PUBLIC 1..
1.0 · rating-1
NXP

SL2ICS2001V1D - I-CODE SLI Label IC bumped wafer specification on UV-tape

SL2ICS2001DW/V1D I-CODE SLI Label IC bumped wafer specification on UV-tape Rev. 3.0 — 5 February 2008 150030 Product data sheet addendum PUBLIC 1..
1.0 · rating-1
Maxim Integrated Products

MAX16072 - uP Supervisory Circuits in 4-Bump (1mm x 1mm) Chip-Scale Package

19-5112; Rev 0; 1/10 www.DataSheet4U.com µP Supervisory Circuits in 4-Bump (1mm x 1mm) Chip-Scale Package General Description The MAX16072/MAX16073/.
1.0 · rating-1
Maxim Integrated Products

MAX16073 - uP Supervisory Circuits in 4-Bump (1mm x 1mm) Chip-Scale Package

19-5112; Rev 0; 1/10 www.DataSheet4U.com µP Supervisory Circuits in 4-Bump (1mm x 1mm) Chip-Scale Package General Description The MAX16072/MAX16073/.
1.0 · rating-1
Maxim Integrated Products

MAX16074 - uP Supervisory Circuits in 4-Bump (1mm x 1mm) Chip-Scale Package

19-5112; Rev 0; 1/10 www.DataSheet4U.com µP Supervisory Circuits in 4-Bump (1mm x 1mm) Chip-Scale Package General Description The MAX16072/MAX16073/.
1.0 · rating-1
Maxim Integrated Products

MAX44281 - 4-Bump Op Amp

Click here for production status of specific part numbers. MAX44281 EVALUATION KIT AVAILABLE Ultra-Small, Ultra-Thin, 4-Bump Op Amp General Descript.
1.0 · rating-1
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