Compression Datasheet | Specifications & PDF Download

SA8507 VOICE SIGNAL COMPRESSION AND EXPANSION CIRCUIT WITH AUTO GAIN CONTORL DESCRIPTION SA8507 is a automatic gain control system that is used for

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SM5902AF NIPPON PRECISION CIRCUITS INC. compression and non compression type shock-proof memory controller Overview The SM5902 is a compression and

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SA8507 VOICE SIGNAL COMPRESSION AND EXPANSION CIRCUIT WITH AUTO GAIN CONTORL DESCRIPTION SA8507 is a automatic gain control system that is used for

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APLUS INTEGRATED CIRCUITS INC. APC5800E APC5800E DE-COMPRESSION VOICE IC 1. CHIP FEATURES. DUAL OPERATION FREQUENCIES: - 32.768 KHZ & 0.5 SECOND TIM

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APLUS INTEGRATED CIRCUITS INC. APC5830 APC5830 DE-COMPRESSION VOICE IC 1. CHIP FEATURES. DUAL OPERATION FREQUENCIES: - 32.768 KHZ & 0.5 SECOND TIMER

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APLUS INTEGRATED CIRCUITS INC. APC5860 APC5860 DE-COMPRESSION VOICE IC 1. CHIP FEATURES. DUAL OPERATION FREQUENCIES: - 32.768 KHZ & 0.5 SECOND TIMER

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APLUS INTEGRATED CIRCUITS INC. APC5890 APC5890 DE-COMPRESSION VOICE IC 1. CHIP FEATURES. DUAL OPERATION FREQUENCIES: - 32.768 KHZ & 0.5 SECOND TIMER

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INTEGRATED CIRCUITS DATA SHEET SAA2521 Masking threshold processor for MPEG layer 1 audio compression applications Preliminary specification File und

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MOTOROLA MPC561PB/D Rev. 1, December 2001 SEMICONDUCTOR PRODUCT BRIEF MPC561/MPC562 MPC563/MPC564 Product Brief MPC561/MPC562 / MPC563/MPC564 RISC

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www.DataSheet4U.com DataSheet4U.com DataShee DataSheet4U.com DataSheet 4 U .com www.DataSheet4U.com et4U.com DataSheet4U.com DataShee DataShe

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FX1901 Compression Load Cell SPECIFICATIONS  High Reliability Design for OEM, Appliance and Medical Applications  10 – 200 lbf Ranges  Compact Coi

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Ordering number : EN *5753 CMOS LSI LC8213K Image Data Compression/Expansion Processor Preliminary Overview The LC8213K compresses and expands the b

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Ordering number : EN*4909A CMOS LSI LC8220 JPEG Still Color Image Compression/Decompression LSI Preliminaly Overview The LC8220 JPEG LSI implements

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Features • • • • • • • • • • Compatible with the JPEG Baseline Standard as Defined by ISO IS 109 18-1 Highly-integrated, Low-cost Single Chip Solution

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