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< DIPIPM > SLIMDIP-S TRANSFER MOLDING TYPE INSULATED TYPE OUTLINE MAIN FUNCTION AND RATINGS  RC-IGBT inverter bridge for three phase DC-to-AC power

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< DIPIPM > SLIMDIP-L TRANSFER MOLDING TYPE INSULATED TYPE OUTLINE MAIN FUNCTION AND RATINGS  RC-IGBT inverter bridge for three phase DC-to-AC power

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MITSUBISHI DIODE MODULES RM50TC-M,-H,-24,-2H MEDIUM POWER GENERAL USE INSULATED TYPE RM50TC-M,-H,-24,-2H • IO • VRRM DC output current

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MITSUBISHI SWITCHING DIODE MC931 HIGH-SPEED SWITCHING/SILICON EPITAXIAL TYPE (SERIES TYPE) DESCRIPTION The MC931 is a silicon epitaxial double diode

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MITSUBISHI LINEAR ICs MS216 DUAL LARGE·CURRENT OPERATIONAL AMPLIFIERS (DUAL POWER SUPPLY TYPE) DESCRIPTION The M5216 is a semiconductor integrated ci

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` HK 4100F/4101F SUBMINIATURE SIGNAL RELAY Features ● 3A switching capability ● 1 Form C ,B&Aconfiguration ● Standard PCB layout ● Plastic sealed an

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www.DataSheet4U.com H-CSP12F 12 (30 CM) SUBWOOFER 12 (30 ) Instruction manual www.DataSheet4U.com Description The set of subwoofer includes: - sub

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8P2S-A EIAJ Package Code SOP8-P-225-1.27 JEDEC Code – Weight(g) 0.07 Lead Material Cu Alloy Plastic 8pin 225mil SOP e b2 8 5 HE E e1 Recommen

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MITSUBISHI SEMICONDUCTOR 〈TRIAC〉 BCR8PM MEDIUM POWER USE INSULATED TYPE, PLANAR PASSIVATION TYPE BCR8PM OUTLINE DRAWING 10.5 MAX 5.2 Dimensions in

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Type 103P Vishay Sprague Paper Capacitors Metal Case, Film/Foil, 10 Ampere Thru-Pass, Subminiature FEATURES • Bulkhead mounting • Excellent RFI speci

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