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< DIPIPM > SLIMDIP-L TRANSFER MOLDING TYPE INSULATED TYPE OUTLINE MAIN FUNCTION AND RATINGS  RC-IGBT inverter bridge for three phase DC-to-AC power

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< DIPIPM > SLIMDIP-S TRANSFER MOLDING TYPE INSULATED TYPE OUTLINE MAIN FUNCTION AND RATINGS  RC-IGBT inverter bridge for three phase DC-to-AC power

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HK 19F SUBMINIATURE DIP RELAY Features ● 2 Form C configuration ● High switching capacity: 125VA/60W ● Bifurcated contacts ● Epoxy sealed for automat

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MITSUBISHI LINEAR ICs MS216 DUAL LARGE·CURRENT OPERATIONAL AMPLIFIERS (DUAL POWER SUPPLY TYPE) DESCRIPTION The M5216 is a semiconductor integrated ci

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MITSUBISHI SOUND PROCESSORS M61503FP TONE CONTROL/VOLUME CONTROL DESCRIPTION The M61503FP is a sound controller IC with the BBE sound sound techno

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< Silicon RF Power MOS FET (Discrete) > RD15HVF1 RoHS Compliance, Silicon MOSFET Power Transistor, 175MHz, 15W DESCRIPTION RD15HVF1 is a MOS FET type

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MITSUBISHI LINEAR ICs M5231L VARIABLE OUTPUT VOLTAGE REGULATOR DESCRIPTION The M5231 L is a semiconductor integrated circuit which is designed for v

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8P2S-A EIAJ Package Code SOP8-P-225-1.27 JEDEC Code – Weight(g) 0.07 Lead Material Cu Alloy Plastic 8pin 225mil SOP e b2 8 5 HE E e1 Recommen

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HK 19F SUBMINIATURE DIP RELAY Features ● 2 Form C configuration ● High switching capacity: 125VA/60W ● Bifurcated contacts ● Epoxy sealed for automat

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ACT7005/7006 Single Package Solution Dual Transceiver, Protocol, Subsystem Features • Incorporates Transceivers, Protocol, and System Interface Compon

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30DL20 POTTING TYPT HV SUBASSEMBLY VOLTAGE RANGE: 20 KV CURRENT: 3.0 A Features Diffused Junction High Voltage Capability High Case Dielectric Streng

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` HK 4100F/4101F SUBMINIATURE SIGNAL RELAY Features ● 3A switching capability ● 1 Form C ,B&Aconfiguration ● Standard PCB layout ● Plastic sealed an

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