AC08DSMA (NEC)
(AC08DSMA / AC08FSMA) 8A RESIN INSULATION TYPE TRIAC
DATA SHEET
AC08DSMA,AC08FSMA
8 A RESIN INSULATION TYPE TRIAC
THYRISTORS
DESCRIPTION
The AC08DSMA and AC08FSMA are resin insulation type TRIACs with
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GL372 (Sharp)
(GL371 / GL372) Compact Resin Stem Type Infrared Emittinf Diode
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KMB472 (YHDC)
Epoxy resin encapsulated thyristors trigger transformer
Epoxy resin encapsulated thyristors trigger transformer KMB series
Model：KMB472 Series
Characteristics: Direct substitute for foreign similar product.
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L4100 (Hamamatsu Corporation)
Resin-potted metal package LED
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GL380 (Sharp Electrionic Components)
High Output/ f 3mm ResinMold Type Infrared Emitting Diode
GL380/GL381
GL380/GL381
s Features
1. High output ( I E : MIN. 4.5mW/sr at I F = 50mA, GL380 ) ( I E : MIN. 8.5mW/sr at I F = 50mA, GL381 ) 2. Compac
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GL381 (Sharp Electrionic Components)
High Output/ f 3mm ResinMold Type Infrared Emitting Diode
GL380/GL381
GL380/GL381
s Features
1. High output ( I E : MIN. 4.5mW/sr at I F = 50mA, GL380 ) ( I E : MIN. 8.5mW/sr at I F = 50mA, GL381 ) 2. Compac
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GL390 (Sharp Electrionic Components)
Thin Bow Type Resin Mold Package Infrared Emitting Diodes
GL390/GL390V
GL390/GL390V
s Features
1. Thin bow type resin mold package (Resin area : 2.0 x 3.1 x 5.2 mm) 2. Low peak forward voltage ( GL390V) VFM
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GL390V (Sharp Electrionic Components)
Thin Bow Type Resin Mold Package Infrared Emitting Diodes
GL390/GL390V
GL390/GL390V
s Features
1. Thin bow type resin mold package (Resin area : 2.0 x 3.1 x 5.2 mm) 2. Low peak forward voltage ( GL390V) VFM
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GL537 (Sharp Electrionic Components)
5mm Resin Mold Type Infrared Emitting Diode
GL537/GL538
GL537/GL538
s Features
1. High output power I E : TYP. 30mW/sr at I F = 50mA (GL538 ) 2. Beam angle GL538 ∆θ : TYP. ± 13˚ GL537 ∆θ : TYP.
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GL538 (Sharp Electrionic Components)
5mm Resin Mold Type Infrared Emitting Diode
GL537/GL538
GL537/GL538
s Features
1. High output power I E : TYP. 30mW/sr at I F = 50mA (GL538 ) 2. Beam angle GL538 ∆θ : TYP. ± 13˚ GL537 ∆θ : TYP.
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GL560 (Sharp Electrionic Components)
Low Peak Forward Voltage Type 5 Resin Mold Package Infrared Emitting Diodes
GL560/GL561
GL560/GL561
s Features
1. Low peak forward voltage suitable for battery drive ( VFM : TYP.1.7V at I FM : 0.5A) 2. φ 5 resin mold package
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GL561 (Sharp Electrionic Components)
Low Peak Forward Voltage Type 5 Resin Mold Package Infrared Emitting Diodes
GL560/GL561
GL560/GL561
s Features
1. Low peak forward voltage suitable for battery drive ( VFM : TYP.1.7V at I FM : 0.5A) 2. φ 5 resin mold package
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PT380 (Sharp Electrionic Components)
High Sensitivity/ f 3mm Resin Mold Type Phototransistor
PT380/PT380F/PT381/PT381F
PT380/PT380F PT381/PT381F
s Features
1. High sensitivity ( IC : MIN.160 µ A at E V = 100lx, PT380 ) ( IC : MIN.120 µ A at E
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PT380F (Sharp Electrionic Components)
High Sensitivity/ f 3mm Resin Mold Type Phototransistor
PT380/PT380F/PT381/PT381F
PT380/PT380F PT381/PT381F
s Features
1. High sensitivity ( IC : MIN.160 µ A at E V = 100lx, PT380 ) ( IC : MIN.120 µ A at E
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PT381 (Sharp Electrionic Components)
High Sensitivity/ f 3mm Resin Mold Type Phototransistor
PT380/PT380F/PT381/PT381F
PT380/PT380F PT381/PT381F
s Features
1. High sensitivity ( IC : MIN.160 µ A at E V = 100lx, PT380 ) ( IC : MIN.120 µ A at E
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PT381F (Sharp Electrionic Components)
High Sensitivity/ f 3mm Resin Mold Type Phototransistor
PT380/PT380F/PT381/PT381F
PT380/PT380F PT381/PT381F
s Features
1. High sensitivity ( IC : MIN.160 µ A at E V = 100lx, PT380 ) ( IC : MIN.120 µ A at E
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P1395-01 (Hamamatsu Corporation)
Resin coating.dual type
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P2405 (Hamamatsu Corporation)
Resin coating.dual type
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P2478-01 (Hamamatsu Corporation)
Resin coating.dual type
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ETQW (Vishay Siliconix)
RESIN-COATED / RADIAL-LEAD TANTALUM CAPACITORS
ETQW
Vishay Roederstein
Resin-Coated, Radial-Lead Tantalum Capacitors
FEATURES
• • • • • • • • • • • Tantalum capacitors with sintered anode and soli
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