AWT6302 Description
The AWT6302 meets the increasing demands for higher efficiency and linearity in CDMA 1X handsets, while reducing pcb area by 44%. The package pinout was chosen to enable handset manufacturers to switch from a 4mm x 4mm PA module with very few layout changes to the phone board. The PA module is optimized for VREF = +2.8 V, a requirement for patibility with the Qualm® 6000 chipset.